Phase change inductor cooling apparatus and method of use thereof

ABSTRACT

The invention comprises a phase change inductor cooling system. The cooling system uses a non-conductive refrigerant in proximate and/or in direct contact with an inductor. Heat from the inductor changes the refrigerant from a liquid to a gas phase, which removes heat from the inductor. The gas phase refrigerant is subsequently removed from the inductor to remove heat from the environment about the inductor. The refrigerant is optionally recirculated using the steps of condensing and/or compressing the refrigerant prior to reintroduction into the environment proximate and/or in direct contact with the inductor.

CROSS REFERENCES TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. patent applicationSer. No. 13/107,828 filed May 13, 2011, which

-   -   is a continuation-in-part of U.S. patent application Ser. No.        12/098,880 filed Apr. 4, 2008, which        -   claims benefit of U.S. provisional patent application No.            60/910,333 filed Apr. 5, 2007; and        -   is a continuation-in-part of U.S. patent application Ser.            No. 11/156,080 filed Jun. 15, 2005 (now U.S. Pat. No.            7,471,181), which claims benefit of U.S. provisional patent            application No. 60/580,922 filed Jun. 17, 2004;    -   is a continuation-in-part of U.S. patent application Ser. No.        12/197,034 filed Aug. 22, 2008, which claims benefit of U.S.        provisional patent application No. 60/957,371, filed on Aug. 22,        2007; and    -   is a continuation-in-part of U.S. patent application Ser. No.        12/434,894 filed Aug. 2, 2010, which        -   is a continuation-in-part of U.S. patent application Ser.            No. 12/206,584 filed Sep. 8, 2008 (now U.S. Pat. No.            7,855,629); and        -   claims benefit of U.S. provisional patent application Ser.            No. 61/050,084, filed May 2, 2008,    -   all of which are incorporated herein in their entirety by this        reference thereto.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a power converter apparatus and method of usethereof.

2. Discussion of the Prior Art

Power is generated from a number of sources. The generated power isnecessarily converted, such as before entering the power grid or priorto use. In many industrial applications, electromagnetic components,such as inductors and capacitors, are used in power filtering. Importantfactors in the design of power filtering methods and apparatus includecost, size, efficiency, resonant points, inductor impedance, inductanceat desired frequencies, and/or inductance capacity.

What is needed is a more efficient inductor apparatus and method of usethereof.

SUMMARY OF THE INVENTION

The invention comprises a liquid/gas phase change cooled inductorapparatus and method of use thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the present invention is derived byreferring to the detailed description and described embodiments whenconsidered in connection with the following illustrative figures. In thefollowing figures, like reference numbers refer to similar elements andsteps throughout the figures.

FIGS. 1A, 1B, and 1C, respectively illustrate: a power filteringprocess, a grid power filtering process, and a process for filteringgenerated power;

FIG. 2 illustrates multi-phase inductor/capacitor component mounting anda filter circuit for power processing;

FIG. 3 further illustrates capacitor mounting;

FIG. 4 illustrates a face view of an inductor;

FIG. 5 illustrates a side view of an inductor;

FIG. 6 illustrates an inductor core and an inductor winding;

FIG. 7 provides exemplary BH curve results; and

FIG. 8 illustrates a sectioned inductor;

FIG. 9 illustrates partial circumferential inductor winding spacers;

FIG. 10 illustrates an inductor with multiple winding spacers;

FIG. 11 illustrates two winding turns on an inductor;

FIG. 12 illustrates multiple wires winding an inductor;

FIG. 13 illustrates tilted winding spacers on an inductor;

FIG. 14 illustrates tilted and rotated winding spacers on an inductor;

FIG. 15 illustrates a capacitor array;

FIG. 16 illustrates a bundt pan inductor cooling system;

FIG. 17 illustrates a potted cooling line inductor cooling system;

FIG. 18 illustrates a wrapped inductor cooling system;

FIG. 19 illustrates an oil/coolant immersed cooling system;

FIG. 20 illustrates use of a chill plate in cooling an inductor; and

FIG. 21 illustrates a refrigerant phase change on the surface of aninductor.

Elements and steps in the figures are illustrated for simplicity andclarity and have not necessarily been rendered according to anyparticular sequence. For example, steps that are performed concurrentlyor in different order are illustrated in the figures to help improveunderstanding of embodiments of the present invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The invention comprises a phase change cooled inductor apparatus andmethod of use thereof.

In one embodiment, a refrigerant is used to cool an inductor where therefrigerant undergoes a phase change from liquid to vapor or gas in acontainer holding the inductor. For example, in the phase changeinductor cooling system the cooling system uses a non-conductiverefrigerant in proximate and/or in direct contact with an inductor. Heatfrom the inductor changes the refrigerant from a liquid to a gas phase,which removes heat from the inductor. The gas phase refrigerant issubsequently removed from the inductor to remove heat from theenvironment about the inductor. The refrigerant is optionallyrecirculated using the steps of condensing and/or compressing therefrigerant prior to reintroduction into the environment proximateand/or in direct contact with the inductor.

In another embodiment, a liquid cooled inductor system is provided,where a substantially non-conductive immersion fluid directly contactsat least a portion of an inductor, such as the inductor winding and/orthe inductor core.

In yet another embodiment, a distributed gap inductor, optionally foruse with medium voltage power, apparatus and method of use thereof, isprovided.

Methods and apparatus according to various embodiments preferablyoperate in conjunction with an inductor and/or a capacitor. For example,an inverter/converter system using at least one inductor and at leastone capacitor optionally mounts the electromagnetic components in avertical format, which reduces space and/or material requirements. Inanother example, the inductor comprises a substantially annular core anda winding. The inductor is preferably configured for high currentapplications, such as at or above about 50, 100, or 200 amperes and/orfor medium voltage or mid-level power systems, such as power systemsoperating at about 2,000 to 5,000 volts. In yet another example, acapacitor array is preferably used in processing a provided powersupply.

Embodiments are described partly in terms of functional components andvarious assembly and/or operating steps. Such functional components areoptionally realized by any number of components configured to performthe specified functions and to achieve the various results. For example,embodiments optionally use various elements, materials, coils, cores,filters, supplies, loads, passive components, and/or active components,which optionally carry out functions related to those described. Inaddition, embodiments described herein are optionally practiced inconjunction with any number of applications, environments, and/orpassive circuit elements. The systems and components described hereinmerely exemplify applications. Further, embodiments described hereinoptionally use any number of conventional techniques for manufacturing,assembling, connecting, and/or operation. Components, systems, andapparatus described herein are optionally used in any combination and/orpermutation.

Electrical System

An electrical system preferably includes an electromagnetic componentoperating in conjunction with an electric current to create a magneticfield, such as with a transformer, an inductor, and/or a capacitorarray. In one embodiment, the electrical system comprises aninverter/converter system having a filter circuit, such as a low passfilter and/or a high pass filter. The power supply or inverter/convertercomprises any suitable power supply or inverter/converter, such as aninverter for a variable speed drive, an adjustable speed drive, and/oran inverter/converter that provides power from an energy device.Examples of an energy device include an electrical transmission line, agenerator, a turbine, a battery, a flywheel, a fuel cell, a solar cell,a wind turbine, use of a biomass, and/or any high frequency inverter orconverter system.

The electrical system described herein is optionally adaptable for anysuitable application or environment, such as variable speed drivesystems, uninterruptible power supplies, backup power systems,inverters, and/or converters for renewable energy systems, hybrid energyvehicles, tractors, cranes, trucks and other machinery using fuel cells,batteries, hydrogen, wind, solar, biomass and other hybrid energysources, regeneration drive systems for motors, motor testingregenerative systems, and other inverter and/or converter applications.Backup power systems optionally include, for example, superconductingmagnets, batteries, and/or flywheel technology. Renewable energy systemsoptionally include any of: solar power, a fuel cell, a wind turbine,hydrogen, use of a biomass, and/or a natural gas turbine.

In various embodiments, the electrical system is adaptable for energystorage or a generation system using direct current (DC) or alternatingcurrent (AC) electricity configured to backup, store, and/or generatedistributed power. Various embodiments described herein are particularlysuitable for high current applications, such as currents greater thanabout one hundred amperes (A), currents greater than about two hundredamperes, and more particularly currents greater than about four hundredamperes. Embodiments described herein are also suitable for use withelectrical systems exhibiting multiple combined signals, such as one ormore pulse width modulated (PWM) higher frequency signals superimposedon a lower frequency waveform. For example, a switching element maygenerate a PWM ripple on a main supply waveform. Such electrical systemsoperating at currents greater than about one hundred amperes operatewithin a field of art substantially different than low power electricalsystems, such as those operating at sub-ampere levels or at about 2, 5,10, 20, or 50 amperes.

Various embodiments are optionally adapted for high-current invertersand/or converters. An inverter produces alternating current from adirect current. A converter processes AC or DC power to provide adifferent electrical waveform. The term converter denotes a mechanismfor either processing AC power into DC power, which is a rectifier, orderiving power with an AC waveform from DC power, which is an inverter.An inverter/converter system is either an inverter system or a convertersystem. Converters are used for many applications, such as rectificationfrom AC to supply electrochemical processes with large controlled levelsof direct current, rectification of AC to DC followed by inversion to acontrolled frequency of AC to supply variable-speed AC motors,interfacing DC power sources, such as fuel cells and photoelectricdevices, to AC distribution systems, production of DC from AC power forsubway and streetcar systems, for controlled DC voltage forspeed-control of DC motors in numerous industrial applications, and/orfor transmission of DC electric power between rectifier stations andinverter stations within AC generation and transmission networks.

Filtering

Referring now to FIG. 1A, a power processing system 100 is provided. Ina first case, AC grid 110 current or power is processed to provideoutput current or output power 150, such as to a load 152. In a secondcase, generated power 154 is processed, such as for delivery to the ACgrid 110. In the first case, a first filter 120 is used to protect theAC grid from energy reflected from an inverter/converter 130, such as tomeet or exceed IEEE 519 requirements for grid transmission.Subsequently, the electricity is further filtered, such as with a secondfilter 140 or is provided to the load 152. In the second case, thegenerated power 154 is provided to the inverter/converter 130 andsubsequently filtered, such as with the first filter 120 beforesupplying the power to the AC grid 110. Examples for each of these casesare further described, infra.

Referring now to FIG. 1B, an example of processing AC power 102 from theAC grid 110 is provided. In this case, electricity flows from the ACgrid 110 to the load 152. In this example, AC power from the AC grid 110is passed through an input filter 122 to the inverter/converter 130. Theinput filter 122 uses at least one inductor and optionally uses at leastone capacitor and/or other electrical components. The input filterfunctions to protect quality of power on the AC grid 110 from harmonicsor energy reflected from the inverter/converter 130 and/or to filterpower from the AC grid 110. Output from the inverter/converter 130 issubsequently passed through an output filter 142. The output filter 142includes at least one inductor and optionally includes one or moreadditional electrical components, such as one or more capacitors. Outputfrom the output filter 142 is subsequently delivered to the load 152,such as to a motor, chiller, or pump. In a first instance, the load 152is an inductor motor, such as an inductor motor operating at about 50 or60 Hz. In a second instance, the load 152 is a permanent magnet motor,such as a motor having a fundamental frequency of about 250 to 1000 Hz.

Referring now to FIG. 1C, an example of processing generated power fromthe generator 154 is provided. In this case, electricity flows from thegenerator 154 to the AC grid 110. The generator 154 provides power tothe inverter/converter 130. Optionally, the generated power is processedthrough a generator filter 144 before delivery to the inverter/converter130. Power from the inverter/converter 130 is filtered with a grid tiefilter 124, which includes at least one inductor and optionally includesone or more additional electrical components, such as a capacitor.Output from the grid tie filter 124 is delivered to the AC grid 110. Afirst example of a grid tie filter 124 is a filter using an inductor. Asecond example of a grid tie filter 124 is a filter using a firstinductor, a capacitor, and a second inductor for each phase of power.Optionally, output from the inverter/converter 130 is filtered using atleast one inductor and passed directly to a load, such as a motor.

In the power processing system 100, the power supply system or inputpower includes any other appropriate elements or systems, such as avoltage or current source and a switching system or element. The supplyoptionally operates in conjunction with various forms of modulation,such as pulse width modulation, resonant conversion, quasi-resonantconversion, and/or phase modulation.

Filter circuits in the power processing system 100 are configured tofilter selected components from the supply signal. The selectedcomponents include any elements to be attenuated or eliminated from thesupply signal, such as noise and/or harmonic components. For example,filter circuits reduce total harmonic distortion. In one embodiment, thefilter circuits are configured to filter higher frequency harmonics overthe fundamental frequency. Examples of fundamental frequencies include:direct current (DC), 50 Hz, 60 Hz, and/or 400 Hz signals. Examples ofhigher frequency harmonics include harmonics over about 300, 500, 600,800, 1000, or 2000 Hz in the supply signal, such as harmonics induced bythe operating switching frequency of insulated gate bipolar transistors(IGBTs) and/or any other electrically operated switches. The filtercircuit optionally includes passive components, such as aninductor-capacitor filter comprised of an inductor, a capacitor, and insome embodiments a resistor. The values and configuration of theinductor and the capacitor are selected according to any suitablecriteria, such as to configure the filter circuits to a selected cutofffrequency, which determines the frequencies of signal componentsfiltered by the filter circuit. The inductor is preferably configured tooperate according to selected characteristics, such as in conjunctionwith high current without excessive heating or operating within safetycompliance temperature requirements.

Power Processing System

The power processing system 100 is optionally used to filter single ormulti-phase power, such as three phase power. Herein, for clarity ofpresentation AC input power from the grid 110 or input power 112 is usedin the examples. Though not described in each example, the componentsand/or systems described herein additionally apply generator systems,such as the system for processing generated power.

Referring now to FIG. 2, an illustrative example of multi-phase powerfiltering is provided. Input power 112 is processed using the powerprocessing system 100 to yield filtered and/or transformed output power160. In this example, three-phase power is processed. The three phases,of the three-phase input power, are denoted U1, V1, and W1. The inputpower 112 is connected to a corresponding phase terminal U1 220, V1 222,and/or W1 224, where the phase terminals are connected to or integratedwith the power processing system 100. For clarity, processing of asingle phase is described, which is illustrative of multi-phase powerprocessing. The input power 112 is then processed by sequential use ofan inductor 230 and a capacitor 250. The inductor and capacitor systemis further described, infra. After the inductor/capacitor processing,the three phases of processed power, corresponding to U1, V1, and W1 aredenoted U2, V2, and W2, respectively. The power is subsequently outputas the processed and/or filtered power 150. Additional elements of thepower processing system 100, in terms of the inductor 230, a coolingsystem 240, and mounting of the capacitors 250, are further describedinfra.

Isolators

Referring still to FIG. 2 and now to FIG. 3, in the power processingsystem 100, the inductor 230 is optionally mounted, directly orindirectly, to a base plate 210 via a mount 232, via an inductorisolator 320, and/or via a mounting plate 284. Preferably, the inductorisolator 320 is used to attach the mount 232 indirectly to the baseplate 210. The inductor 230 is additionally preferably mounted using across-member or clamp bar 234 running through a central opening 310 inthe inductor 230. The capacitor 250 is preferably similarly mounted witha capacitor isolator 325 to the base plate 210. The isolators 320, 325are preferably vibration, shock, and/or temperature isolators. Theisolators 320, 325 are preferably a glass-reinforced plastic, a glassfiber-reinforced plastic, a fiber reinforced polymer made of a plasticmatrix reinforced by fine fibers made of glass, and/or a fiberglassmaterial, such as a Glastic® (Rochling Glastic Composites, Ohio)material.

Cooling System

Referring still to FIG. 2 and now to FIG. 4, an optional cooling system240 is used in the power processing system 100. In the illustratedembodiment, the cooling system 240 uses a fan to move air across theinductor 230. The fan either pushes or pulls an air flow around andthrough the inductor 230. An optional air guide shroud 450 is placedover 1, 2, 3, or more inductors 230 to facilitate focused air movementresultant from the cooling system 240, such as airflow from a fan,around the inductors 230. The shroud preferably encompasses at leastthree sides of the one or more inductors. To achieve enhanced cooling,the inductor is preferably mounted on an outer face 416 of the toroid.For example, the inductor 230 is mounted in a vertical orientation usingthe clamp bar 234. Vertical mounting of the inductor is furtherdescribed, infra. Optional liquid based cooling systems 240 are furtherdescribed, infra.

Buss bars

Referring again to FIG. 2 and FIG. 3, in the power processing system100, the capacitor 250 is preferably an array of capacitors connected inparallel to achieve a specific capacitance for each of the multi-phasesof the power supply 110. In FIG. 2, two capacitors 250 are illustratedfor each of the multi-phased power supply U1, V1, and W1. The capacitorsare mounted using a series of busbars or buss bars 260. A buss bar 260carries power from one point to another or connects one point toanother.

Common Neutral Buss bar

A particular type of buss bar 260 is a common neutral buss bar 265,which connects two phases. In one example of an electrical embodiment ofa delta capacitor connection in a poly phase system, it is preferable tocreate a common neutral point for the capacitors. Still referring toFIG. 2, an example of two phases using multiple capacitors in parallelwith a common neutral buss bar 265 is provided. The common neutral bussbar 265 functions as both a mount and a parallel bus conductor for twophases. This concept minimizes the number of parallel conductors, in a‘U’ shape or in a parallel ‘∥’ shape in the present embodiment, to thenumber of phases plus two. In a traditional parallel buss bar system,the number of buss bars 260 used is the number of phases multiplied bytwo or number of phases times two. Hence, the use of ‘U’ shaped bussbars 260 reduces the number of buss bars used compared to thetraditional mounting system. Minimizing the number of buss bars requiredto make a poly phase capacitor assembly, where multiple smallercapacitors are positioned in parallel to create a larger capacitance,minimizes the volume of space needed and the volume of buss barconductors. Reduction in buss bar 260 volume and/or quantity minimizescost of the capacitor assembly. After the two phases that share a commonneutral bus conductor are assembled, a simple jumper 270 bus conductoris optionally used to jumper those two phases to any quantity ofadditional phases as shown in FIG. 2. The jumper optionally includes aslittle as two connection points. The jumper optionally functions as ahandle on the capacitor assembly for handling. It is also typical thatthis common neutral bus conductor is the same shape as the otherparallel bus conductors throughout the capacitor assembly. This commonshape theme, a ‘U’ shape in the present embodiment, allows for symmetryof the assembly in a poly phase structure as shown in FIG. 2.

Parallel Buss Bars Function as Mounting Chassis

Herein, the buss bars 260, 265 preferably mechanically support thecapacitors 250. The use of the buss bars 260, 265 for mechanical supportof the capacitors 250 has several benefits. The parallel conducting bussbar connecting multiple smaller value capacitors to create a largervalue, which can be used in a ‘U’ shape, also functions as a mountingchassis. Incorporating the buss bar as a mounting chassis removes therequirement of the capacitor 250 to have separate, isolated mountingbrackets. These brackets typically would mount to a ground point ormetal chassis in a filter system. In the present embodiment, thecapacitor terminals and the parallel buss bar support the capacitors andeliminate the need for expensive mounting brackets and additionalmounting hardware for these brackets. This mounting concept allows foroptimal vertical or horizontal packaging of capacitors.

Parallel Buss Bar

A parallel buss bar is optionally configured to carry smaller currentsthan an input/output terminal. The size of the buss bar 260 is minimizeddue to its handling of only the capacitor current and not the total linecurrent, where the capacitor current is less than about 10, 20, 30, or40 percent of the total line current. The parallel conducting buss bar,which also functions as the mounting chassis, does not have to conductfull line current of the filter. Hence the parallel conducting buss baris optionally reduced in cross-section area when compared to the outputterminal 350. This smaller sized buss bar reduces the cost of theconductors required for the parallel configuration of the capacitors byreducing the conductor material volume. The full line current that isconnected from the inductor to the terminal is substantially larger thanthe current that travels through the capacitors. For example, thecapacitor current is less than about 10, 20, 30, or 40 percent of thefull line current. In addition, when an inductor is used that impedesthe higher frequencies by about 20, 100, 200, 500, 1000, 1500, or 2000KHz before they reach the capacitor buss bar and capacitors, thisparallel capacitor current is lower still than when an inferior filterinductor, whose resonant frequency is below 5, 10, 20, 40, 50, 75, 100KHz, is used which cannot impede the higher frequencies due to its highinternal capacitive construction or low resonant frequency. In caseswhere there exist high frequency harmonics and the inductor is unable toimpede these high frequencies, the capacitors must absorb and filterthese currents which causes them to operate at higher temperatures,which decreases the capacitors usable life in the circuit. In addition,these un-impeded frequencies add to the necessary volume requirement ofthe capacitor buss bar and mounting chassis, which increases cost of thepower processing system 100.

Staggered Capacitor Mounting

Use of a staggered capacitor mounting system reduces and/or minimizesvolume requirements for the capacitors.

Referring now to FIG. 3, a filter system 300 is illustrated. The filtersystem 300 preferably includes a mounting plate or base plate 210. Themounting plate 210 attaches to the inductor 230 and a set of capacitors330. The capacitors are preferably staggered in an about close packedarrangement having a spacing between rows and staggered columns of lessthan about 0.25, 0.5, or 1 inch. The staggered packaging allows optimumpackaging of multiple smaller value capacitors in parallel creating alarger capacitance in a small, efficient space. Buss bars 260 areoptionally used in a ‘U’ shape or a parallel ‘∥’ shape to optimizepackaging size for a required capacitance value. The ‘U’ shape withstaggered capacitors 250 are optionally mounted vertically to themounting surface, as shown in FIG. 3 or horizontally to the mountingsurface as shown in FIG. 15. The ‘U’ shape buss bar is optionally twoabout parallel bars with one or more optional mechanical stabilizingspacers, 267, at selected locations to mechanically stabilize both aboutparallel sides of the ‘U’ shape buss bar as the buss bar extends fromthe terminal 350, as shown in FIG. 3 and FIG. 15.

In this example, the capacitor bus work 260 is in a ‘U’ shape thatfastens to a terminal 350 attached to the base plate 210 via aninsulator 325. The ‘U’ shape is formed by a first buss bar 260 joined toa second buss bar 260 via the terminal 350. The ‘U’ shape isalternatively shaped to maintain the staggered spacing, such as with anm by n array of capacitors, where m and n are integers, where m and nare each two or greater. The buss bar matrix or assembly containsneutral points 265 that are preferably shared between two phases of apoly-phase system. The neutral buss bars 260, 265 connect to allthree-phases via the jumper 270. The shared buss bar 265 allows thepoly-phase system to have x+2 buss bars where x is the number of phasesin the poly-phase system instead of the traditional two buss bars perphase in a regular system. Optionally, the common buss bar 265 comprisesa metal thickness of approximately twice the size of the buss bar 260.The staggered spacing enhances packaging efficiency by allowing amaximum number of capacitors in a given volume while maintaining aminimal distance between capacitors needed for the optional coolingsystem 240, such as cooling fans and/or use of a coolant fluid. Use of acoolant fluid directly contacting the inductor 230 is described, infra.The distance from the mounting surface 210 to the bottom or closestpoint on the body of the second closest capacitor 250, is less than thedistance from the mounting surface 210 to the top or furthest point onthe body of the closest capacitor. This mounting system is designated asa staggered mounting system for parallel connected capacitors in asingle or poly phase filter system.

Module Mounting

In the power processing system 100, modular components are optionallyused. For example, a first mounting plate 280 is illustrated that mountsthree buss bars 260 and two arrays of capacitors 250 to the base plate210. A second mounting plate 282 is illustrated that mounts a pair ofbuss bars 260 and a set of capacitors to the base plate 210. A thirdmounting plate 284 is illustrated that vertically mounts an inductor andoptionally an associated cooling system 240 or fan to the base plate210. Generally, one or more mounting plates are used to mount anycombination of inductor 230, capacitor 240, buss bar 260, and/or coolingsystem 240 to the base plate 210.

Referring now to FIG. 3, an additional side view example of a powerprocessing system 100 is illustrated. FIG. 3 further illustrates avertical mounting system 300 for the inductor 230 and/or the capacitor250. For clarity, the example illustrated in FIG. 3 shows only a singlephase of a multi-phase power filtering system. Additionally, wiringelements are removed in FIG. 3 for clarity. Additional inductor 230 andcapacitor 250 detail is provided, infra.

Inductor

Preferable embodiments of the inductor 230 are further described herein.Particularly, in a first section, vertical mounting of an inductor isdescribed. In a second section, inductor elements are described.

For clarity, an axis system is herein defined relative to an inductor230. An x/y plane runs parallel to an inductor face 417, such as theinductor front face 418 and/or the inductor back face 419. A z-axis runsthrough the inductor 230 perpendicular to the x/y plane. Hence, the axissystem is not defined relative to gravity, but rather is definedrelative to an inductor 230.

Vertical Inductor Mounting

FIG. 3 illustrates an indirect vertical mounting system of the inductor230 to the base plate 210 with an optional intermediate vibration,shock, and/or temperature isolator 320. The isolator 320 is preferably aGlastic® material, described supra. The inductor 230 is preferably anedge mounted inductor with a toroidal core, described infra.

Referring now to FIG. 6, an inductor 230 optionally includes a core 610and a winding 620. The winding 620 is wrapped around the core 610. Thecore 610 and the winding 620 are suitably disposed on a base plate 210to support the core 610 in any suitable position and/or to conduct heataway from the core 610 and the winding 620. The inductor 610 optionallyincludes any additional elements or features, such as other itemsrequired in manufacturing.

In one embodiment, an inductor 230 or toroidal inductor is mounted onthe inductor edge, is vibration isolated, and/or is optionallytemperature controlled.

Referring now to FIG. 4 and FIG. 5, an example of an edge mountedinductor system 400 is illustrated. FIG. 4 illustrates an edge mountedtoroidal inductor 230 from a face view. FIG. 5 illustrates the inductor230 from an edge view. When looking through a center hole 412 of theinductor 230, the inductor 230 is viewed from its face. When looking atthe inductor 230 along an axis-normal to an axis running through thecenter hole 412 of the inductor 230, the inductor 230 is viewed from theinductor edge. In an edge mounted inductor system, the edge of theinductor is mounted to a surface. In a face mounted inductor system, theface of the inductor 230 is mounted to a surface. Elements of the edgemounted inductor system 400 are described, infra.

Referring still to FIG. 4, the inductor 230 is optionally mounted in avertical orientation, where a center line through the center hole 412 ofthe inductor runs along an axis 405 that is about horizontal or parallelto a mounting surface 430 or base plate 210. The mounting surface isoptionally horizontal or vertical, such as parallel to a floor, parallelto a wall, or parallel to a mounting surface on a slope. In FIG. 4, theinductor 230 is illustrated in a vertical position relative to ahorizontal mounting surface with the axis 405 running parallel to afloor. While descriptions herein use a horizontal mounting surface toillustrate the components of the edge mounted inductor mounting system400, the system is equally applicable to a vertical mounting surface. Tofurther clarify, the edge mounted inductor system 400 described hereinalso applies to mounting the edge of the inductor to a vertical mountingsurface or an angled mounting surface. The angled mounting surface isoptionally angled at least 10, 20, 30, 40, 50, 60, 70, or 80 degrees offof horizontal. In these cases, the axis 405 still runs about parallel tothe mounting surface, such as about parallel to the vertical mountingsurface or about parallel to a sloped mounting surface 430, base plate210, or other surface.

Still referring to FIG. 4 and to FIG. 5, the inductor 230 has an innersurface 414 surrounding the center opening, center aperture, or centerhole 412; an outer edge 416 or outer edge surface; and two faces 417,including a front face 418 and a back face 419. An inductor sectionrefers to a portion of the about annular inductor between a point n theinner surface 414 and a closest point on the outer edge 416. The surfaceof the inductor 230 includes: the inner surface 414, outer edge 416 orouter edge surface, and faces 417. The surface of the inductor 230 istypically the outer surface of the magnet wire windings surrounding thecore of the inductor 230. The magnet wire is preferably a wire with analuminum oxide coating for minimal corona potential. The magnet wire ispreferably temperature resistant or rated to at least two hundreddegrees Centigrade. The winding of the wire or magnet wire is furtherdescribed, infra. The minimum weight of the inductor is optionally about2, 5, 10, or 20 pounds.

Still referring to FIG. 4, an optional clamp bar 234 runs through thecenter hole 412 of the inductor 230. The clamp bar 234 is preferably asingle piece, but is optionally composed of multiple elements. The clampbar 234 is connected directly or indirectly to the mounting surface 430and/or to a base plate 210. The clamp bar 234 is composed of anon-conductive material as metal running through the center hole of theinductor 230 functions as a magnetic shorted turn in the system. Theclamp bar 234 is preferably a rigid material or a semi-rigid materialthat bends slightly when clamped, bolted, or fastened to the mountingsurface 430. The clamp bar 234 is preferably rated to a temperature ofat least 130 degrees Centigrade. Preferably, the clamp bar material is afiberglass material, such as a thermoset fiberglass-reinforced polyestermaterial, that offers strength, excellent insulating electricalproperties, dimensional stability, flame resistance, flexibility, andhigh property retention under heat. An example of a fiberglass clamp barmaterial is Glastic®. Optionally the clamp bar 234 is a plastic, a fiberreinforced resin, a woven paper, an impregnated glass fiber, a circuitboard material, a high performance fiberglass composite, a phenolicmaterial, a thermoplastic, a fiberglass reinforced plastic, a ceramic,or the like, which is preferably rated to at least 150 degreesCentigrade. Any of the mounting hardware 422 is optionally made of thesematerials.

Still referring to FIG. 4 and to FIG. 5, the clamp bar 234 is preferablyattached to the mounting surface 430 via mounting hardware 422. Examplesof mounting hardware include: a bolt, a threaded bolt, a rod, a clampbar 234, a mounting insulator 424, a connector, a metal connector,and/or a non-metallic connector. Preferably, the mounting hardware isnon-conducting. If the mounting hardware 422 is conductive, then themounting hardware 422 is preferably contained in or isolated from theinductor 230 via a mounting insulator 424. Preferably, an electricallyinsulating surface is present, such as on the mounting hardware. Theelectrically insulating surface proximately contacts the faces of theinductor 230. Alternatively, an insulating gap 426 of at least about onemillimeter exists between the faces 417 of the inductor 230 and themetallic or insulated mounting hardware 422, such as a bolt or rod.

An example of a mounting insulator is a hollow rod where the outersurface of the hollow rod is non-conductive and the hollow rod has acenter channel 425 through which mounting hardware, such as a threadedbolt, runs. This system allows a stronger metallic and/or conductingmounting hardware to connect the clamp bar 234 to the mounting surface430. FIG. 5 illustrates an exemplary bolt head 423 fastening a threadedbolt into the base plate 210 where the base plate has a threaded hole452. An example of a mounting insulator 424 is a mounting rod. Themounting rod is preferably composed of a material or is at leastpartially covered with a material where the material is electricallyisolating.

The mounting hardware 422 preferably covers a minimal area of theinductor 230 to facilitate cooling with a cooling element 240, such asvia one or more fans. In one case, the mounting hardware 422 does notcontact the faces 417 of the inductor 230. In another case, the mountinghardware 422 contacts the faces 417 of the inductor 230 with a contactarea. Preferably the contact area is less than about 1, 2, 5, 10, 20, or30 percent of the surface area of the faces 417. The minimal contactarea of the mounting hardware with the inductor surface facilitatestemperature control and/or cooling of the inductor 230 by allowingairflow to reach the majority of the inductor 230 surface. Preferably,the mounting hardware is temperature resistant to at least 130 degreescentigrade. Preferably, the mounting hardware 422 comprises curvedsurfaces circumferential about its length to facilitate airflow aroundthe length of the mounting hardware 422 to the faces 417 of the inductor230.

Still referring to FIG. 5, the mounting hardware 422 connects the clampbar 234, which passes through the inductor, to the mounting surface 430.The mounting surface is optionally non-metallic and is rigid orsemi-rigid. Generally, the properties of the clamp bar 234 apply to theproperties of the mounting surface 430. The mounting surface 430 isoptionally (1) composed of the same material as the clamp bar 234 or is(2) a distinct material type from that of the clamp bar 234.

Still referring to FIG. 5, in one example the inductor 230 is held in avertical position by the clamp bar 234, mounting hardware 422, andmounting surface 430 where the clamp bar 234 contacts the inner surface414 of the inductor 230 and the mounting surface 430 contacts the outeredge 416 of the inductor 230.

Still referring to FIG. 5, in a second example one or more vibrationisolators 440 are used in the mounting system. As illustrated, a firstvibration isolator 440 is positioned between the clamp bar 234 and theinner surface 414 of the inductor 230 and a second vibration isolator440 is positioned between the outer edge 416 of the inductor 230 and themounting surface 430. The vibration isolator 440 is a shock absorber.The vibration isolator optionally deforms under the force or pressurenecessary to hold the inductor 230 in a vertical position or edgemounted position using the clamp bar 234, mounting hardware 422, andmounting surface 430. The vibration isolator preferably is temperaturerated to at least two hundred degrees Centigrade. Preferably thevibration isolator 440 is about ⅛, ¼, ⅜, or ½ inch in thickness. Anexample of a vibration isolator is silicone rubber. Optionally, thevibration isolator 440 contains a glass weave 442 for strength. Thevibration isolator optionally is internal to the inductor opening orextends out of the inductor 230 central hole 412.

Still referring to FIG. 5, a common mounting surface 430 is optionallyused as a mount for multiple inductors. Alternatively, the mountingsurface 430 is connected to a base plate 210. The base plate 210 isoptionally used as a base for multiple mounting surfaces connected tomultiple inductors, such as three inductors used with a poly-phase powersystem where one inductor handles each phase of the power system. Thebase plate 210 optionally supports multiple cooling elements, such asone or more cooling elements per inductor. The base plate is preferablymetal for strength and durability. The system reduces cost associatedwith the mounting surface 430 as the less expensive base plate 210 isused for controlling relative position of multiple inductors and theamount of mounting surface 430 material is reduced and/or minimized.Further, the contact area ratio of the mounting surface 430 to theinductor surface is preferably minimized, such as to less than about 1,2, 4, 6, 8, 10, or 20 percent of the surface of the inductor 230, tofacilitate efficient heat transfer by maximizing the surface area of theinductor 230 available for cooling by the cooling element 240 or bypassive cooling.

Still referring to FIG. 4, an optional cooling system 240 is used tocool the inductor. In one example, a fan blows air about one direction,such as horizontally, onto the front face 418, through the center hole412, along the inner edge 414 of the inductor 230, and/or along theouter edge 416 of the inductor 230 where the clamp bar 234, vibrationisolator 440, mounting hardware 422, and mounting surface 430 combinedcontact less than about 1, 2, 5, 10, 20, or 30 percent of the surfacearea of the inductor 230, which yields efficient cooling of the inductor230 using minimal cooling elements and associated cooling element powerdue to a large fraction of the surface area of the inductor 230 beingavailable for cooling. To aid cooling, an optional shroud 450 about theinductor 230 guides the cooling air flow about the inductor 230 surface.The shroud 450 optionally circumferentially encloses the inductor along1, 2, 3, or 4 sides. The shroud 450 is optionally any geometric shape.

Preferably, mounting hardware 422 is used on both sides of the inductor230. Optionally, the inductor 230 mounting hardware 422 is used besideonly one face of the inductor 230 and the clamp bar 234 or equivalentpresses down or hooks over the inductor 230 through the hole 412 or overthe entire inductor 230, such as over the top of the inductor 230.

In yet another embodiment, a section or row of inductors 230 areelevated in a given airflow path. In this layout, a single airflow pathor thermal reduction apparatus is used to cool a maximum number oftoroid filter inductors in a filter circuit, reducing additional fans orthermal management systems required as well as overall packaging size.This increases the robustness of the filter with fewer moving parts todegrade as well as minimizes cost and packaging size. The elevatedlayout of a first inductor relative to a second inductor allows air tocool inductors in the first row and then to also cool inductors in anelevated rear row without excessive heating of the air from the frontrow and with a single airflow path and direction from the thermalmanagement source. Through elevation, a single fan is preferably used tocool a plurality of inductors approximately evenly, where multiple fanswould have been needed to achieve the same result. This efficientconcept drastically reduces fan count and package size and allows forcooling airflow in a single direction.

An example of an inductor mounting system is provided. Preferably, thepedestal or non-planar base plate, on which the inductors are mounted,is made out of any suitable material. In the current embodiment, thepedestal is made out of sheet metal and fixed to a location behind andabove the bottom row of inductors. Multiple orientations of the pedestaland/or thermal management devices are similarly implemented to achievethese results. In this example, toroid inductors mounted on the pedestaluse a silicone rubber shock absorber mounting concept with a bottomplate, base plate, mounting hardware 122, a center hole clamp bar withinsulated metal fasteners, or mounting hardware 122 that allows them tobe safe for mounting at this elevated height. The mounting conceptoptionally includes a non-conductive material of suitable temperatureand mechanical integrity, such as Glastic®, as a bottom mounting plate.The toroid sits on a shock absorber of silicone rubber material ofsuitable temperature and mechanical integrity. In this example, thevibration isolator 440, such as silicone rubber, is about 0.125 inchthick with a woven fiber center to provide mechanical durability to themounting. The toroid is held in place by a center hole clamp bar ofGlastic® or other non-conductive material of suitable temperature andmechanical integrity. The clamp bar fits through the center hole of thetoroid and preferably has a minimum of one hole on each end, two totalholes, to allow fasteners to fasten the clamp bar to the bottom plateand pedestal or base plate. Beneath the center clamp bar is anothershock absorbing piece of silicone rubber with the same properties as thebottom shock absorbing rubber. The clamp bar is torqued down on bothsides using fasteners, such as standard metal fasteners. The fastenersare preferably an insulated non-conductive material of suitabletemperature and mechanical integrity. The mounting system allows formounting of the elevated pedestal inductors with the center holeparallel to the mounting chassis and allows the maximum surface area ofthe toroid to be exposed to the moving air, thus maximizing theefficiency of the thermal management system. In addition, this mountingsystem allows for the two shock absorbing rubber or equivalent materialsto both hold the toroid inductor in an upright position. The shockabsorbing material also absorbs additional shock and vibration resultingduring operation, transportation, or installation so that core materialshock and winding shock is minimized.

Inductor Elements

The inductor 230 is further described herein. Preferably, the inductorincludes a pressed powder highly permeable and linear core having a BHcurve slope of about 11 ΔB/ΔH surrounded by windings and/or anintegrated cooling system.

Referring now to FIG. 6, the inductor 230 comprises a core 610 and awinding 620. The inductor 230 preferably includes any additionalelements or features, such as other items required in manufacturing. Thewinding 620 is wrapped around the core 610. The core 610 providesmechanical support for the winding 620 and is characterized by apermeability for storing or transferring a magnetic field in response tocurrent flowing through the winding 620. Herein, permeability is definedin terms of a slope of ΔB/ΔH. The core 610 and winding 620 are suitablydisposed on or in a mount or housing 210 to support the core 610 in anysuitable position and/or to conduct heat away from the core 610 and thewinding 620.

The inductor core optionally provides mechanical support for theinductor winding and comprises any suitable core for providing thedesired magnetic permeability and/or other characteristics. Theconfiguration and materials of the core 610 are optionally selectedaccording to any suitable criteria, such as a BH curve profile,permeability, availability, cost, operating characteristics in variousenvironments, ability to withstand various conditions, heat generation,thermal aging, thermal impedance, thermal coefficient of expansion,curie temperature, tensile strength, core losses, and/or compressionstrength. For example, the core 610 is optionally configured to exhibita selected permeability and BH curve.

For example, the core 610 is configured to exhibit low core losses undervarious operating conditions, such as in response to a high frequencypulse width modulation or harmonic ripple, compared to conventionalmaterials. Conventional core materials are laminated silicon steel orconventional silicon iron steel designs. The inventor has determinedthat the core preferably comprises an iron powder material or multiplematerials to provide a specific BH curve, described infra. The specifiedBH curve allows creation of inductors having: smaller components,reduced emissions, reduced core losses, and increased surface area in agiven volume when compared to inductors using the above describedtraditional materials.

BH Curve

There are two quantities that physicists use to denote magnetic field, Band H. The vector field, H, is known among electrical engineers as themagnetic field intensity or magnetic field strength, which is also knownas an auxiliary magnetic field or a magnetizing field. The vector field,H, is a function of applied current. The vector field, B, is known asmagnetic flux density or magnetic induction and has the internationalsystem of units (SI units) of Teslas (T). Thus, a BH curve is induction,B, as a function of the magnetic field, H.

Inductor Core/Distributed Gap

In one exemplary embodiment, the core 610 comprises at least twomaterials. In one example, the core includes two materials, a magneticmaterial and a coating agent. In one case, the magnetic materialincludes a first transition series metal in elemental form and/or in anyoxidation state. In a second case, the magnetic material is a form ofiron. The second material is optionally a non-magnetic material and/oris a highly thermally conductive material, such as carbon, a carbonallotrope, and/or a form of carbon. A form of carbon includes anyarrangement of elemental carbon and/or carbon bonded to one or moreother types of atoms.

In one case, the magnetic material is present as particles and theparticles are each coated with the coating agent to form coatedparticles. For example, particles of the magnetic material are eachsubstantially coated with one, two, three, or more layers of a coatingmaterial, such as a form of carbon. The carbon provides a shock absorberaffect, which minimized high frequency core loss from the inductor 230.In a preferred embodiment, particles of iron, or a form thereof, arecoated with multiple layers of carbon to form carbon coated particles.The coated particles are optionally combined with a filler, such as athermosetting polymer or an epoxy. The filler provides an average gapdistance between the coated particles.

In another case, the magnetic material is present as a first layer inthe form of particles and the particles are each at least partiallycoated, in a second layer, with the coating agent to form coatedparticles. The coated particles are subsequently coated with anotherlayer of a magnetic material, which is optionally the first magneticmaterial, to form a three layer particle. The three layer particle isoptionally coated with a fourth layer of a non-magnetic material, whichis optionally the non-magnetic material of the second layer. The processis optionally repeated to form particles of n layers, where n is apositive integer, such as about 2, 3, 4, 5, 10, 15, or 20. The n layersoptionally alternate between a magnetic layer and a non-magnetic layer.Optionally, the innermost particle of each coated particle is anon-magnetic particle.

Optionally, the magnetic material of one or more of the layers in thecoated particle is an alloy. In one example, the alloy contains at least70, 75, 80, 85, or 90 percent iron or a form of iron, such as iron at anoxidation state or bound to another atom. In another example, the alloycontains at least 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10 percent aluminum or aform of aluminum. Optionally, the alloy contains a metalloid, such asboron, silicon, germanium, arsenic, antimony, and/or tellurium. Anexample of an alloy is sendust, which contains about eighty-five percentiron, nine percent silicon, and six percent aluminum. Sendust exhibitsabout zero magnetostriction.

The coated particles preferably have, with a probability of at leastninety percent, an average cross-sectional length of less than about onemillimeter, one-tenth of a millimeter (100 μm), and/or one-hundredth ofa millimeter (10 μm). While two or more coated particles in the core areoptionally touching, the average gap distance between two coatedparticles is optionally a distance greater than zero and less than aboutone millimeter, one-tenth of a millimeter (100 μm), one-hundredth of amillimeter (10 μm), and/or one-thousandth of a millimeter (1 μm).

With a large number of coated particles in the inductor 230, there exista large number of gaps between two adjacent coated particles that areabout evenly distributed within at least a portion of the inductor. Theabout evenly distributed gaps between particles in the inductor isoptionally referred to as a distributed gap.

In one exemplary manufacturing process, the carbon coated particles aremixed with a filler, such as an epoxy. The resulting mixture isoptionally pressed into a shape, such as an inductor shape, an abouttoroidal shape, an about annular shape, or an about doughnut shape.Optionally, during the pressing process, the filler or epoxy is meltedout. The magnetic path in the inductor goes through the distributedgaps. Small air pockets optionally exist in the inductor 230, such asbetween the coated particles. In use, the magnetic field goes fromcoated particle to coated particle through the filler gaps and/orthrough the air gaps.

The distributed gap nature of the inductor 230 yields an about even Eddyloss, gap loss, or magnetic flux loss. Substantially even distributionof the bonding agent within the iron powder of the core results in theequally distributed gap of the core. The resultant core loss at theswitching frequencies of the electrical switches substantially reducescore losses when compared to silicon iron steel used in conventionaliron core inductor design.

Further, conventional inductor construction requires gaps in themagnetic path of the steel lamination, which are typically outside thecoil construction and are, therefore, unshielded from emitting flux,causing electromagnetically interfering radiation. The electromagneticradiation can adversely affect the electrical system.

The distributed gaps in the magnetic path of the present core 610material are microscopic and substantially evenly distributed throughoutthe core 610. The smaller flux energy at each gap location is alsosurrounded by a winding 620 which functions as an electromagnetic shieldto contain the flux energy. Thus, a pressed powder core surrounded bywindings results in substantially reduced electromagnetic emissions.

Referring now to FIG. 7 and to Table 1, preferred inductance, B, levelsas a function of magnetic force strength are provided. The core 610material preferably comprises: an inductance of about −4400 to 4400 Bover a range of about −400 to 400 H with a slope of about 11 ΔB/ΔH.Herein, permeability refers to the slope of a BH curve and has units ofΔB/ΔH. Core materials having a substantially linear BH curve with ΔB/ΔHin the range of ten to twelve are usable in a preferred embodiment. Lesspreferably, core materials having a substantially linear BH curve with apermeability, ΔB/ΔH, in the range of nine to thirteen are acceptable.Two exemplary BH curves 710, 720 are provided in FIG. 7.

TABLE 1 BH Response (Permeability of Eleven) B H (Tesla/Gauss) (Oersted)−4400 −400 −2200 −200 −1100 −100 1100 100 2200 200 4400 400

Optionally, the inductor 230 is configured to carry a magnetic field ofat least one of:

-   -   less than about 2000, 2500, 3000, or 3500 Gauss at an absolute        Oersted value of at least 100;    -   less than about 4000, 5000, 6000, or 7000 Gauss at an absolute        Oersted value of at least 200;    -   less than about 6000, 7500, 9000, or 10,500 Gauss at an absolute        Oersted value of at least 300; and    -   less than about 8000, 10,000, 12,000, or 14,000 Gauss at an        absolute Oersted value of at least 400.

In one embodiment, the core 610 material exhibits a substantially linearflux density response to magnetizing forces over a large range with verylow residual flux, B_(R). The core 610 preferably provides inductancestability over a range of changing potential loads, from low load tofull load to overload.

The core 610 is preferably configured in an about toroidal, aboutcircular, doughnut, or annular shape where the toroid is of any size.The configuration of the core 610 is preferably selected to maximize theinductance rating, A_(L), of the core 610, enhance heat dissipation,reduce emissions, facilitate winding, and/or reduce residualcapacitances.

Medium Voltage

Herein, a corona potential is the potential for long term breakdown ofwinding wire insulation due to high electric potentials between windingturns winding a mid-level power inductor in a converter system. The highelectric potential creates ozone, which breaks down insulation coatingthe winding wire and results in degraded performance or failure of theinductor.

Herein, power is described as a function of voltage. Typically, homesand buildings use low voltage power supplies, which range from about 100to 690 volts. Large industry, such as steel mills, chemical plants,paper mills, and other large industrial processes optionally use mediumvoltage filter inductors and/or medium voltage power supplies. Herein,medium voltage power refers to power having about 1,500 to 35,000 voltsor optionally about 2,000 to 5,000 volts. High voltage power refers tohigh voltage systems or high voltage power lines, which operate fromabout 20,000 to 150,000 volts.

In one embodiment, a power converter method and apparatus is described,which is optionally part of a filtering method and apparatus. Theinductor is configured with inductor winding spacers, such as a maininductor spacer and/or inductor segmenting winding spacers. The spacersare used to space winding turns of a winding coil about an inductor. Theinsulation of the inductor spacer minimizes energy transfer betweenwindings and thus minimizes corona potential, formation of corrosiveozone through ionization of oxygen, correlated breakdown of insulationon the winding wire, and/or electrical shorts in the inductor.

More particularly, the inductor configured with winding spacers uses thewinding spacers to separate winding turns of a winding wire about thecore of the inductor, which reduces the volts per turn. The reduction involts per turn minimizes corona potential of the inductor. Additionalelectromagnetic components, such as capacitors, are integrated with theinductor configured with winding spacers to facilitate power processingand/or power conversion. The inductors configured with winding spacersdescribed herein are designed to operate on medium voltage systems andto minimize corona potential in a mid-level power converter. Theinductors configured with winding spacers, described infra, areoptionally used on low and/or high voltage systems.

Inductor Winding Spacers

In still yet another embodiment, the inductor 230 is optionallyconfigured with inductor winding spacers. Generally, the inductorwinding spacers or simply winding spacers are used to space windingturns to reduce corona potential, described infra.

For clarity of presentation, initially the inductor winding isdescribed. Subsequently, the corona potential is further described. Thenthe inductor spacers are described. Finally, the use of the inductorspacers to reduce corona potential through controlled winding withwinding turns separated by the insulating inductor spacers is described.

Inductor Winding

The inductor 230 includes a core 610 that is wound with a winding 620.The winding 620 comprises a conductor for conducting electrical currentthrough the inductor 230. The winding 620 optionally comprises anysuitable material for conducting current, such as conventional wire,foil, twisted cables, and the like formed of copper, aluminum, gold,silver, or other electrically conductive material or alloy at anytemperature.

Preferably, the winding 620 comprises a set of wires, such as coppermagnet wires, wound around the core 610 in one or more layers.Preferably, each wire of the set of wires is wound through a number ofturns about the core 610, where each element of the set of wiresinitiates the winding at a winding input terminal and completes thewinding at a winding output terminal. Optionally, the set of wiresforming the winding 620 nearly entirely covers the core 610, such as atoroidal shaped core. Leakage flux is inhibited from exiting theinductor 230 by the winding 620, thus reducing electromagneticemissions, as the windings 620 function as a shield against suchemissions. In addition, the soft radii in the geometry of the windings620 and the core 610 material are less prone to leakage flux thanconventional configurations. Stated again, the toroidal or doughnutshaped core provides a curved outer surface upon which the windings arewound. The curved surface allows about uniform support for the windingsand minimizes and/or reduced gaps between the winding and the core.

Corona Potential

A corona potential is the potential for long term breakdown of windingwire insulation due to the high electric potentials between windingturns near the inductor 230, which creates ozone. The ozone breaks downinsulation coating the winding wire, results in degraded performance,and/or results in failure of the inductor 230.

Inductor Spacers

The inductor 230 is optionally configured with inductor winding spacers,such as a main inductor spacer 810 and/or inductor segmenting windingspacers 820. Generally, the spacers are used to space winding turns,described infra. Collectively, the main inductor spacer 810 andsegmenting winding spacers 820 are referred to herein as inductorspacers. Generally, the inductor spacer comprises a non-conductivematerial, such as air, a plastic, or a dielectric material. Theinsulation of the inductor spacer minimizes energy transfer betweenwindings and thus minimizes or reduces corona potential, formation ofcorrosive ozone through ionization of oxygen, correlated breakdown ofinsulation on the winding wire, and/or electrical shorts in the inductor230.

A first low power example, of about 690 volts, is used to illustrateneed for a main inductor spacer 810 and lack of need for inductorsegmenting winding spacers 820 in a low power transformer. In thisexample, the inductor 230 includes a core 610 wound twenty times with awinding 620, where each turn of the winding about the core is aboutevenly separated by rotating the core 610 about eighteen degrees (360degrees/20 turns) for each turn of the winding. If each turn of thewinding 620 about the core results in 34.5 volts, then the potentialbetween turns is only about 34.5 volts, which is not of sufficientmagnitude to result in a corona potential. Hence, inductor segmentationwinding spacers 820 are not required in a low power inductor/conductorsystem. However, potential between the winding input terminal and thewinding output terminal is about 690 volts (34.5 volts times 20 turns).More specifically, the potential between a winding wire near the inputterminal and the winding wire near the output terminal is about 690volts, which can result in corona potential. To minimize the coronapotential, an insulating main inductor spacer 810 is placed between theinput terminal and the output terminal. The insulating property of themain inductor spacer 810 minimizes or prevents shorts in the system, asdescribed supra.

A second medium power example illustrates the need for both a maininductor spacer 810 and inductor segmenting winding spacers 820 in amedium power system. In this example, the inductor 230 includes a core610 wound 20 times with a winding 620, where each turn of the windingabout the core is about evenly separated by rotating the core 610 about18 degrees (360 degrees/20 turns) for each turn of the winding. If eachturn of the winding 620 about the core results in about 225 volts, thenthe potential between individual turns is about 225 volts, which is ofsufficient magnitude to result in a corona potential. Placement of aninductor winding spacer 820 between each turn reduces the coronapotential between individual turns of the winding. Further, potentialbetween the winding input terminal and the winding output terminal isabout 4500 volts (225 volts times 20 turns). More specifically, thepotential between a winding wire near the input terminal and the windingwire near the output terminal is about 4500 volts, which results incorona potential. To minimize the corona potential, an insulating maininductor spacer 810 is placed between the input terminal and the outputterminal. Since the potential between winding wires near the inputterminal and output terminal is larger (4500 volts) than the potentialbetween individual turns of wire (225 volts), the main inductor spacer810 is preferably wider and/or has a greater insulation than theindividual inductor segmenting winding spacers 820.

In a low power system, the main inductor spacer 810 is optionally about0.125 inch in thickness. In a mid-level power system, the main inductorspacer is preferably about 0.375 to 0.500 inch in thickness. Optionally,the main inductor spacer 810 thickness is greater than about 0.125,0.250, 0.375, 0.500, 0.625, or 0.850 inch. The main inductor spacer 810is preferably thicker, or more insulating, than the individualsegmenting winding spacers 820. Optionally, the individual segmentingwinding spacers 820 are greater than about 0.0312, 0.0625, 0.125, 0.250,0.375 inches thick. Generally, the main inductor spacer 810 has agreater thickness or cross-sectional width that yields a largerelectrically insulating resistivity versus the cross-section or width ofone of the individual segmenting winding spacers 820. Preferably, theelectrical resistivity of the main inductor spacer 810 between the firstturn of the winding wire proximate the input terminal and the terminaloutput turn proximate the output terminal is at least about 10, 20, 30,40, 50, 60, 70, 80, 90, or 100 percent greater than the electricalresistivity of a given inductor segmenting winding spacer 820 separatingtwo consecutive turns of the winding 620 about the core 610 of theinductor 230. The main inductor spacer 810 is optionally a firstmaterial and the inductor segmenting spacers are optionally a secondmaterial, where the first material is not the same material as thesecond material. The main inductor spacer 810 and inductor segmentingwinding spacers 820 are further described, infra.

In yet another example, the converter operates at levels exceeding about2000 volts at currents exceeding about 400 amperes. For instance, theconverter operates at above about 1000, 2000, 3000, 4000, or 5000 voltsat currents above any of about 500, 1000, or 1500 amperes. Preferablythe converter operates at levels less than about 15,000 volts.

Referring now to FIG. 8, an example of an inductor 230 configured withfour spacers is illustrated. For clarity, the main inductor spacer 810is positioned at the twelve o'clock position and the inductor segmentingwinding spacers 820 are positioned relative to the main inductor windingspacer. The clock position used herein are for clarity of presentation.The spacers are optionally present at any position on the inductor andany coordinate system is optionally used. For example, referring stillto FIG. 8, the three illustrated inductor segmenting winding spacers 820are positioned at about the three o'clock, six o'clock, and nine o'clockpositions. However, the main inductor spacer 810 is optionally presentat any position and the inductor segmenting winding spacers 820 arepositioned relative to the main inductor spacer 810. As illustrated, thefour spacers segment the toroid into four sections. Particularly, themain inductor spacer 810 and the first inductor segmenting windingspacer at the three o'clock position create a first inductor section831. The first of the inductor segmenting winding spacers at the threeo'clock position and a second of the inductor segmenting winding spacersat the six o'clock position create a second inductor section 832. Thesecond of the inductor segmenting winding spacers at the six o'clockposition and a third of the inductor segmenting winding spacers at thenine o'clock position create a third inductor section 833. The third ofthe inductor segmenting winding spacers at the nine o'clock position andthe main inductor spacer 810 at about the twelve o'clock position createa fourth inductor section 834. In this system, preferably a first turnof the winding 620 wraps the core 610 in the first inductor section 831,a second turn of the winding 620 wraps the core 610 in the secondinductor section 832, a third turn of the winding 620 wraps the core 610in the third inductor section 833, and a fourth turn of the winding 620wraps the core 610 in the fourth inductor section 834. Generally, thenumber of inductor spacers 810 is set to create 2, 3, 4, 5, 6, 7, 8, 9,10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, or more inductor sections.Generally, the angle theta is the angle between two inductor sectionsfrom a central point 401 of the inductor 230. Each of the spacers 810,820 is optionally a ring about the core 610 or is a series of segmentsabout forming a circumferential ring about the core 610.

Inductor spacers provide an insulating layer between turns of thewinding. Still referring to FIG. 8, an individual spacer 810, 820preferably circumferentially surrounds the core 610. Preferably, theindividual spacers 810, 820 extend radially outwardly from an outersurface of the core 610. The spacers 810, 820 optionally contact and/orproximally contact the core 610, such as via an adhesive layer or via aspring loaded fit.

Referring now to FIG. 9, optionally one or more of the spacers do notentirely circumferentially surround the core 610. For example, shortspacers 920 separate the individual turns of the winding at least in thecentral aperture 412 of the core 610. In the illustrated example, theshort spacers 920 separate the individual turns of the winding in thecentral aperture 412 of the core 610 and along a portion of the inductorfaces 417, where geometry dictates that the distance between individualturns of the winding 620 is small relative to average distance betweenthe wires at the outer face 416.

Referring now to FIGS. 10, 11, and 12, an example of an inductor 230segmented into six sections using a main inductor spacer 810 and a setof inductor segmenting winding spacers 820 is provided. Referring now toFIG. 10, the main inductor spacer 810 and five inductor segmentingwinding spacers 820 segment the periphery of the core into six regions1031, 1032, 1033, 1034, 1035, and 1036.

Referring now to FIG. 11, two turns of a first winding are illustrated.A first winding wire 1140 is wound around the first region core 1031 ina first turn 1141. Similarly, the winding 620 is continued in a secondturn 1142 about a second region of the core 1032. The first turn 1141and the second turn 1142 are separated by a first segmenting windingspacer 1132.

Referring now to FIG. 12, six turns of a first winding are illustrated.Continuing from FIG. 11, the winding 620 is continued in a third turn1143, a fourth turn 1144, a fifth turn 1145, and a sixth turn 1146. Thefirst and second turns 1141, 1142 are separated by the first segmentingwinding spacer 1132, the second and third turns 1142, 1143 are separatedby the second segmenting winding spacer 1133, the third and fourth turns1143, 1144 are separated by the third segmenting winding spacer 1134,the fourth and fifth turns 1144, 1145 are separated by the fourthsegmenting winding spacer 1135, and the fifth and sixth turns 1145, 1146are separated by the fifth segmenting winding spacer 1136. Further, thefirst and sixth turns 1141, 1146 are separated by the main inductorspacer 810. Similarly, the first two turns 1151, 1152 of a secondwinding wire 1150 are illustrated, that are separated by the firstsegmenting winding spacer 1132. Generally, any number of winding wiresare wrapped or layered to form the winding 610 about the core 610 of theinductor 230. An advantage of the system is that in a given inductorsection, such as the first inductor section 1031, each of the windingwires are at about the same potential, which yields essentially no riskof corona potential within a given inductor section. Generally, anm^(th) turn of an n^(th) wire are within about 5, 10, 15, 30, 45, or 60degrees of each other at any position on the inductor, such as at aboutthe six o'clock position.

For a given winding wire, the first turn of the winding wire, such asthe first turn 1141, proximate the input terminal is referred to hereinas an initial input turn. For the given wire, the last turn of the wirebefore the output terminal, such as the sixth turn 1146, is referred toherein as the terminal output turn. The initial input turn and theterminal output turn are preferably separated by the main inductorspacer.

A given inductor segmenting winding spacer 820 optionally separates twoconsecutive winding turns of a winding wire winding the core 610 of theinductor 230.

Referring now to FIG. 13, one embodiment of manufacture rotates the core610 as one or more winding wires are wrapped about the core 610. Forexample, for a four turn winding, the core is rotated about 90 degreeswith each turn. During the winding process, the core 610 is optionallyrotated at an about constant rate or is rotated and stopped with eachturn. To aid in the winding process, the spacers are optionally tilted,rotated, or tilted and rotated. Referring now to FIG. 13, inductorspacers 810, 820 are illustrated that are tilted relative to a spacerabout parallel to the outer face 416 of the inductor 230. For clarity ofpresentation, the inductor spacers are only illustrated on the outeredge of the core 610. Tilted spacers on the outer edge of the inductor230 have a length that is aligned with the z-axis, but are tilted alongthe x- and/or y-axes. More specifically, as the spacer 810, 820 extendsradially outward from the core 610, the spacer 810, 820 position changesin terms of both the x- and y-axes locations. Referring now to FIG. 14,inductor spacers are illustrated that are both tilted and rotated. Forclarity of presentation, the inductor spacers are only illustrated onthe outer edge of the core 610. Tilted and rotated spacers on the outeredge of the core 610 have both a length that is rotated relative to thez-axis and a height that is tilted relative to the x- and/or y-axes, asdescribed supra.

Capacitor

Referring again to FIG. 2, capacitors 250 are used with inductors 230 tocreate a filter to remove harmonic distortion from current and voltagewaveforms. A buss bar carries power from one point to another. Thecapacitor buss bar 260 mounting system minimizes space requirements andoptimizes packaging. The buss bars use a toroid/heat sink integratedsystem solution, THISS®, (CTM Magnetics, Tempe, Ariz.) to filter outputpower 150 and customer generated input power 154. The efficient filteroutput terminal layout described herein minimizes the copper crosssection necessary for the capacitor buss bars 260. The copper crosssection is minimized for the capacitor buss bar by sending the bulk ofthe current directly to the output terminals 221, 223, 225. In thesecircuits, the current carrying capacity of the capacitor bus conductoris a small fraction of the full approximate line frequency load orfundamental frequency current sent to the output load via the outputterminals 221, 223, 225. The termination of the THISS® technology filterinductor is integrated to the capacitor bank for each phase of thesystem. These buss bars are optionally manufactured out of any suitablematerial and are any suitable shape. For instance, the buss bars areoptionally a flat strip or a hollow tube. In one example, flat strips oftinned copper with threaded inserts or tapped threaded holes are usedfor both mounting the capacitors mechanically as well as providingelectrical connection to each capacitor. This system optimizes thepackaging efficiency of the capacitors by mounting them vertically andstaggering each capacitor from each side of the buss bar for maximumdensity in the vertical dimension. A common neutral buss bar or flexcable 265 is used between two phases to further reduce copper quantityand to minimize size. A jumper buss bar connects this common neutralpoint to another phase efficiently, such as through use of an about flatstrip of copper. Connection fittings designed to reduce radio-frequencyinterference and power loss are optionally used. The buss bars areoptionally designed for phase matching and for connecting to existingtransmission apparatus. The buss bars optionally use a mechanicalsupport spacer, 270, made from non magnetic, non conductive materialwith adequate thermal and mechanical properties, such as a suitableepoxy and glass combination, a Glastic® or a Garolite material. Theintegrated output terminal buss bars provide for material handling ofthe filter assembly as well as connection to the sine wave filtered loador motor. Though a three phase implementation is displayed, theimplementation is readily adapted to integrate with other power systems.

Referring now to FIG. 15, an additional example of a capacitor bank 1500is provided. In this example, a three phase system containing five totalbuss bars 260 including a common neutral buss bar 265 is provided. Theillustrated system contains seven columns and three rows of capacitors250 per phase or twenty-one capacitors per phase for each of threephases, U1, V1, W1. Spacers maintain separation of the componentcapacitors. A shared neutral point 270 illustrates two phases sharing asingle shared neutral bus.

Cooling

In still yet another embodiment, the inductor 230 is cooled with acooling system 240, such as with a fan, forced air, a heat sink, a heattransfer element or system, a thermal transfer potting compound, aliquid coolant, and/or a chill plate. Each of these optional coolingsystem elements are further described, infra. While, for clarity,individual cooling elements are described separately, the coolingelements are optionally combined into the cooling system in anypermutation and/or combination.

Heat Sink

A heat sink 1640 is optionally attached to any of the electricalcomponents described herein. Optionally, a heat sink 1640 or a heat sinkfin is affixed to an internal surface of a cooling element container,where the heat sink fin protrudes into an immersion coolant, animmersion fluid, and/or into a potting compound to enhance thermaltransfer away from the inductor 230 to the housing element.

Fan

In one example, a cooling fan is used to move air across any of theelectrical components, such as the inductor 230 and/or the capacitor250. The air flow is optionally a forced air flow. Optionally, the airflow is directed through a shroud 450 encompassing one, two, three ormore inductors 230. Optionally, the shroud 450 encompasses one or moreelectrical components of one, two, three or more power phases.Optionally, the shroud 450 contains an air flow guiding element betweenindividual power phases.

Thermal Transfer Compound

Any of the inductor components, such as the inductor core, inductorwinding, a coating on the inductor core, and/or a coating on theinductor winding is optionally coated with a thermal grease to enhancethermal transfer of heat away from the inductor.

Bundt Cooling System

In another example, a bundt pan style inductor cooling system 1600 isdescribed. Referring now to FIG. 16, a cross-section of a bundt panstyle cooling system is provided. A first element, an inductor guide1610, optionally includes: an outer ring 1612 and/or an inner coolingsegment 1614, elements of which are joined by an inductor positioningbase 1616 to form an open inner ring having at least an outer wall. Theinductor 230 is positioned within the inner ring of the inductor guide1610 with an inductor face 417, such as the inductor front face 418,proximate the inductor positioning base 1616. The inductor guide 1610 isoptionally about joined and/or is proximate to an inductor key 1620,where the inductor guide 1610 and the inductor key 1620 combine to forman inner ring cavity for positioning of the inductor 230. The inductorkey 1620 optionally includes an outside ring 1622, a middle post 1624,and/or an inductor lid 1626. During use, the inductor lid 1626 isproximate an inductor face 417, such as the inductor back face 419. Theinductor base 1610, inductor 230, and inductor lid 1620 are optionallypositioned in any orientation, such as to mount the inductor 230horizontally, vertically, or at an angle relative to gravity.

The bundt style inductor cooling system 1600 facilitates thermalmanagement of the inductor 230. The inductor guide 1610 and/or theinductor lid 1620 is at least partially made of a thermally transmittingmaterial, where the inductor guide 1610 and/or the inductor lid 1620draws heat away from the inductor 230. A thermal transfer agent 1630,such as a thermally conductive potting compound, a thermal grease,and/or a heat transfer liquid is optionally placed between an outersurface of the inductor 230 and an inner surface of the inductor guide1610 and/or the inductor lid 1620. One or more heat sinks 1640 or heatsink fins are optionally attached to any surface of the inductor base1610 and/or the inductor lid 1620. In one case, not illustrated, theheat sink fins function as a mechanical stand under the inductor guide1610 through which air or a liquid coolant optionally flows. Moregenerally, a heat sink 1640 is optionally attached to any of theelectrical components described herein.

For example, the cooling system comprises at least two parts, such as aplurality of coolant containment parts or a bottom section of a coolingjacket and a top section of a cooling jacket. The two parts cometogether to surround or circumferentially surround the wound core duringuse. The top and bottom halves join each other along an axis coming downonto the toroid shape of the wound core, referred to as a z-axis.However, the pieces making up the cooling system are optionallyassembled in any orientation, such as along x-axis and/or y-axis,referring to the axis planes of the toroid.

Further, the top and bottom sections of a cooling jacket are optionallyequal in size or either piece could be from 1 to 99 percent of the massof the sandwiched pair of pieces. For instance, the bottom piece maymake up about 10, 25, 50, 75, or 90 percent of the combined coolingjacket assembly. Still further, the cooling jacket may be composed ofmultiple pieces, such as 3, 4, or more pieces, where the center piecesare rings sandwiched by the top and bottom section of the coolingjacket. Generally, any number of cooling pieces optionally come togetheralong any combination of axes to form a jacket cooling the wound core.Each section of the cooling jacket optionally contains its own coolingin and cooling out lines.

Potted Cooling System

In still another example, a thermally potted cooling inductor coolingsystem 1700 is described. In the potted cooling system, one or moreinductors 230 are positioned within a container 1710. A thermal transferagent 1630 such as a thermally conductive potting agent is placedsubstantially around the inductor 230 inside the container 1710. Thethermally conductive potting agent is any material, compound, or mixtureused to transfer heat away from the inductor 230, such as a resin, athermoplastic, and/or an encapsulant. Optionally, one or more coolinglines 1730 run through the thermal transfer agent. The cooling lines1730 optionally wrap 1732 the inductor 230 in one or more turns to forma cooling coil and/or pass through 1734 the inductor 230 with one ormore turns. Optionally, a coolant runs through the coolant line 1730 toremove heat to a radiator 1740. The radiator is optionally attached tothe housing 1710 or is a stand-alone unit removed from the housing. Apump 1750 is optionally positioned anywhere in the system to move thecoolant sequentially through a cooling line input 1742, through thecooling line 1730 to pick up heat from the inductor 230, through acooling line output 1744, through the radiator 1740 to dissipate heat,and optionally back into the pump 1750. Generally, the thermal transferagent 1630 facilitates movement of heat, relative to air around theinductor 230, to one or more of: a heat sink 1640, the cooling line1730, to the housing 1710, and/or to the ambient environment.

The thermally conductive potting agent optionally exhibits anyappropriate characteristics, such as a high thermal transfercoefficient; resistance to fissure when the mass of theinductor/conductor system has a large internal temperature change, suchas greater than about 50, 100, or 150 degrees Centigrade; flexibility soas not to fissure with temperature variations, such as greater than 100degrees Centigrade, in the potting mass; low thermal impedance betweenthe inductor 230 and heat dissipation elements; sealing characteristicsto seal the inductor assembly from the environment such that a unit canconform to various outdoor functions, such as exposure to water andsalts; and mechanical integrity for holding the heat dissipatingelements and inductor 230 together as a single module at high operatingtemperatures, such as up to about 150 or 200 degrees Centigrade.Examples of potting materials include: an electrical insulatingmaterial, a polyurethane; a urethane; a multi-part urethane; apolyurethane; a multi-component polyurethane; a polyurethane resin; aresin; a polyepoxide; an epoxy; a varnish; an epoxy varnish; acopolymer; a thermosetting polymer; a thermoplastic; a silicone basedmaterial; Conathane® (Cytec Industries, West Peterson, N.J.), such asConathane EN-2551, 2553, 2552, 2550, 2534, 2523, 2521, and EN 7-24;Insulcast® (ITW Insulcast, Roseland, N.J.), such as Insulcast 333;Stycast® (Emerson and Cuming, Billerica, Mass.), such as Stycast 281;and epoxy varnish potting compound. Potting material is optionally mixedwith silica sand or aluminum oxide, such as at about thirty to seventypercent, for example about forty-five percent silica sand or aluminumoxide by volume; to create a potting compound with lower thermalimpedance.

Inductor Cooling Line

In yet another example, an oil/coolant immersed inductor cooling systemis provided. Referring now to FIG. 18, an expanded view example of aliquid cooled induction system 1800 is provided. In the illustratedexample, an inductor 230 is placed into a cooling liquid container 1810.The container 1810 is preferably enclosed, but at least holds animmersion coolant. The immersion coolant is preferably in direct contactwith the inductor 230 and/or the windings of the inductor 230.Optionally, a solid heat transfer material, such as the thermallyconductive potting compound described supra, is used in place of theliquid immersion coolant. Optionally, the immersion coolant directlycontacts at least a portion of the core 610 of the inductor 230, such asnear the input terminal and/or the output terminal. Further, thecontainer 1810 preferably has mounting pads designed to hold theinductor 230 off of the inner surface of the container 1810 to increasecoolant contact with the inductor 230. For example, the inductor 230preferably has feet that allow for immersion coolant contact with abottom side of the inductor 230 to further facilitate heat transfer fromthe inductor to the cooling fluid. The mounting feet are optionallyplaced on a bottom side of the container to facilitate cooling air flowunder the container 1810.

Heat from a circulating coolant, separate from the immersion coolant, ispreferably removed via a heat exchanger. In one example, the circulatingcoolant flows through an exit path 1744, through a heat exchanger, suchas a radiator 1740, and is returned to the container 1810 via a returnpath 1742. Optionally a fan is used to remove heat from the heatexchanger. Typically, a pump 1750 is used in the circulating path tomove the circulating coolant.

Still referring to FIG. 18, the use of the circulating fluid to cool theinductor is further described. Optionally, the cooling line is attachedto a radiator 1740 or outside flow through cooling source. Circulatingcoolant optionally flows through a cooling coil:

-   -   circumferentially surrounding or making at least one cooling        line turn 1820 or circumferential turn about the outer face 416        of the inductor 230 or on an inductor edge;    -   forming a path, such as an about concentrically expanding upper        ring 1830, with subsequent turns of the cooling line forming an        upper cooling surface about parallel to the inductor front face        418;    -   forming a path, such as an about concentrically expanding lower        ring 1840, with subsequent turns of the cooling line forming a        lower cooling surface about parallel to the inductor back face        419; and    -   a cooling line running through the inductor 230 using a        non-electrically conducting cooling coil or cooling coil        segment.

Optionally, the coolant flows sequentially through one or more of theexpanding upper ring 1830, the cooling line turn 1820, and the expandinglower ring 1840 or vise-versa. Optionally, parallel cooling lines runabout, through, and/or near the inductor 230.

Coolant/Inductor Contact

In yet still another example, referring now to FIG. 19, heat istransferred from the inductor 230 to a heat transfer solution 1920directly contacting at least part of the inductor 230.

In one case, the heat transfer solution 1920 transfers heat from theinductor 230 to an inductor housing 1910. In this case, the inductorhousing 1910 radiates the heat to the surrounding environment, such asthrough a heat sink 1640.

In another case, the inductor 230 is in direct contact with the heattransfer solution 1920, such as partially or totally immersed in anon-conductive liquid coolant. The heat transfer solution 1920 absorbsheat energy from the inductor 230 and transfers a portion of that heatto a cooling line 1730 and/or a cooling coil and a coolant therein. Thecooling line 1730, through which a coolant flows runs through the heattransfer solution 1920. The coolant carries the heat out of the inductorhousing 1910 where the heat is removed from the system, such as in aheat exchanger or radiator 1740. The heat exchanger radiates the heatoutside of the sealed inductor housing 1910. The process of heat removaltransfer allows the inductor 230 to maintain an about steady statetemperature under load.

For instance, an inductor 230 with an annular core, a doughnut shapedinductor, an inductor with a toroidal core, or a substantially circularshaped inductor is at least partially immersed in an immersion coolant,where the coolant is in intimate and direct thermal contact with amagnet wire, a winding coating, or the windings 610 about a core of theinductor 230. Optionally, the inductor 230 is fully immersed or sunk inthe coolant. For example, an annular shaped inductor is fully immersedin an insulating coolant that is in intimate thermal contact with theheated magnet wire heat of the toroid surface area. Due to the directcontact of the coolant with the magnet wire or a coating on the magnetwire, the coolant is substantially non-conducting.

The immersion coolant comprises any appropriate coolant, such as a gas,liquid, gas/liquid, or suspended solid at any temperature or pressure.For example, the coolant optionally comprises: a non-conducting liquid,a transformer oil, a mineral oil, a colligative agent, a fluorocarbon, achlorocarbon, a fluorochlorocarbon, a deionized water/alcohol mixture,or a mixture of non-conducting liquids. Less preferably, the coolant isde-ionized water. Due to pinholes in the coating on the magnet wire,slow leakage of ions into the de-ionized water results in anelectrically conductive coolant, which would short circuit the system.Hence, if de-ionized water is used as a coolant, then the coating shouldprevent ion transport. Alternatively, the de-ionized cooling water isperiodically filtered and/or changed. Optionally, an oxygen absorber isadded into the coolant, which prevents ozonation of the oxygen due theremoval of the oxygen from the coolant.

Still referring to FIG. 19, the inductor housing 1910 optionallyencloses two or more inductors 230. The inductors 230 are optionallyvertically mounted using mounting hardware 422 and a clamp bar 234. Theclamp bar optionally runs through the two or more inductors 230. Anoptional clamp bar post 423 is positioned between the inductors 230.

Chill Plate

Often, an inductor 230 in an electrical system is positioned in industryin a sensitive area, such as in an area containing heat sensitiveelectronics or equipment. In an inductor 230 cooling process, heatremoved from the inductor 230 is typically dispersed in the localenvironment, which can disrupt proper function of the sensitiveelectronics or equipment.

In yet still another example, a chill plate is optionally used tominimize heat transfer from the inductor 230 to the local surroundingenvironment, which reduces risk of damage to surrounding electronics.Referring now to FIG. 20, one or more inductors 230 are placed into aheat transfer medium. Moving outward from an inductor, FIG. 20 isdescribed in terms of layers. In a first layer about the inductor, athermal transfer agent is used, such as an immersion coolant 1920,described supra. Optionally, the heat transfer medium is a solid, asemi-solid, or a potting compound, as described supra. In a second layerabout the immersion coolant, a heat transfer interface 2010 is used. Theheat transfer interface is preferably a solid having an inner wallinterface 2012 and an outer wall interface 2014. In a third layer, achill plate is used. In one case, the chill plate is hollow and/or haspassages to allow flow of a circulating coolant. In another case, thechill plate contains cooling lines 1730 through which a circulatingcoolant flows. An optional fourth layer is an outer housing or air.

In use, the inductor 230 generates heat, which is transferred to theimmersion coolant. The immersion coolant transfers heat to the heattransfer interface 2010 through the inner wall surface 2012.Subsequently, the heat transfer interface 2010 transfers heat throughthe outer wall interface 2014 to the chill plate. Heat is removed fromthe chill plate through the use of the circulating fluid, which removesthe heat to an outside environment removed from the sensitive area inthe local environment about the inductor 230.

Phase Change Cooling

Referring now to FIG. 21, a phase change inductor cooling system 2100 isillustrated. In the phase change inductor cooling system 2100, arefrigerant 2160 is present about the inductor 230, such as in directcontact with an element of the inductor 230, in a first liquidrefrigerant phase 2162 and in a second gas refrigerant phase 2164. Thephase change from a liquid to a gas requires energy or heat input. Heatproduced by the inductor 230 is used to phase change the refrigerant2160 from a liquid phase to a gas phase, which reduces the heat of theenvironment about the inductor 230 and hence cools the inductor 230.

Still referring to FIG. 21, an example of the phase change inductorcooling system 2100 is provided. An evaporator chamber 2110, whichencloses the inductor 230, is used to allow the compressed refrigerant2160 to evaporate from liquid refrigerant 2162 to gas refrigerant 2164while absorbing heat in the process. The heated and/or gas phaserefrigerant 2160 is removed from the evaporator chamber 2110, such asthrough a refrigeration circulation line 2150 or outlet and isoptionally recirculated in the cooling system 2100. The outletoptionally carries gas, liquid, or a combination of gas and liquid.Subsequently, the refrigerant 2160 is optionally condensed at anopposite side of the cooling cycle in a condenser 2120, which is locatedoutside of the cooled compartment or evaporation chamber 2110. Thecondenser 2120 is used to compress or force the refrigerant gas 2164through a heat exchange coil, which condenses the refrigerant gas 2164into a refrigerant liquid 2162, thus removing the heat previouslyabsorbed from the inductor 230. A fan 240 is optionally used to removethe released heat from the condenser 2120. Optionally, a reservoir 2140is used to contain a reserve of the refrigerant 2140 in therecirculation system. Subsequently, a gas compressor 2130 or pump isoptionally used to move the refrigerant 2160 through the refrigerantcirculation line 2150. The compressor 2130 is a mechanical device thatincreases the pressure of a gas by reducing its volume. Herein, thecompressor 2130 or optionally a pump increases the pressure on a fluidand transports the fluid through the refrigeration circulation line 2150back to the evaporation chamber 2110 through an inlet, where the processrepeats. Preferably the outlet is vertically above the inlet, the inletis into a region containing liquid, and the outlet is in a regioncontaining gas. In one case, the refrigerant 2160 comprises1,1,1,2-Tetrafluoroethane, R-134a, Genetron 134a, Suva 134a or HFC-134a,which is a haloalkane refrigerant with thermodynamic properties similarto dichlorodifluoromethane, R-12. Generally, any non-conductiverefrigerant is optionally used in the phase change inductor coolingsystem 2100. Optionally, the non-conductive refrigerant is an insulatormaterial resistant to flow of electricity or a dielectric materialhaving a high dielectric constant or a resistance greater than 1, 10, or100 Ohms.

Cooling Multiple Inductors

In yet another example, the cooling system optionally simultaneouslycools multiple inductors 230. For instance, a series of two or moreinductor cores of an inductor/converter system are aligned along asingle axis, where a single axis penetrates through a hollow geometriccenter of each core. A cooling line or a potting material optionallyruns through the hollow geometric center.

Cooling System

Preferably cooling elements work in combination where the coolingelements include one or more of:

-   -   a thermal transfer agent;        -   a thermally conductive potting agent;        -   a circulating coolant;    -   a fan;    -   a shroud;    -   vertical inductor mounting hardware 422;    -   a stand holding inductors at two or more heights from a base        plate 210;    -   a cooling line 1730;        -   a wrapping cooling line 1732 about the inductor 230;        -   a concentric cooling line on a face 417 of the inductor 230        -   a pass through cooling line 1734 passing through the            inductor 230    -   a cooling coil;    -   a heat sink 1640;    -   a chill plate 2020; and        -   coolant flowing through the chill plate.

In another embodiment, the winding 620 comprises a wire having anon-circular cross-sectional shape. For example, the winding 620comprises a rectangular, rhombus, parallelogram, or square shape. In onecase, the height or a cross-sectional shape normal or perpendicular tothe length of the wire is more than ten percent larger or smaller thanthe width of the wire, such as more than 15, 20, 25, 30, 35, 40, 50, 75,or 100 the length.

In still yet another embodiment, the invention comprises and combinationand/or permutation of any of the elements described herein.

The particular implementations shown and described are illustrative ofthe invention and its best mode and are not intended to otherwise limitthe scope of the present invention in any way. Indeed, for the sake ofbrevity, conventional manufacturing, connection, preparation, and otherfunctional aspects of the system may not be described in detail. Whilesingle PWM frequency, single voltage, single power modules, in differingorientations and configurations have been discussed, adaptations andmultiple frequencies, voltages, and modules may be implemented inaccordance with various aspects of the present invention. Furthermore,the connecting lines shown in the various figures are intended torepresent exemplary functional relationships and/or physical couplingsbetween the various elements. Many alternative or additional functionalrelationships or physical connections may be present in a practicalsystem.

In the foregoing description, the invention has been described withreference to specific exemplary embodiments; however, it will beappreciated that various modifications and changes may be made withoutdeparting from the scope of the present invention as set forth herein.The description and figures are to be regarded in an illustrativemanner, rather than a restrictive one and all such modifications areintended to be included within the scope of the present invention.Accordingly, the scope of the invention should be determined by thegeneric embodiments described herein and their legal equivalents ratherthan by merely the specific examples described above. For example, thesteps recited in any method or process embodiment may be executed in anyorder and are not limited to the explicit order presented in thespecific examples. Additionally, the components and/or elements recitedin any apparatus embodiment may be assembled or otherwise operationallyconfigured in a variety of permutations to produce substantially thesame result as the present invention and are accordingly not limited tothe specific configuration recited in the specific examples.

Benefits, other advantages and solutions to problems have been describedabove with regard to particular embodiments; however, any benefit,advantage, solution to problems or any element that may cause anyparticular benefit, advantage or solution to occur or to become morepronounced are not to be construed as critical, required or essentialfeatures or components.

As used herein, the terms “comprises”, “comprising”, or any variationthereof, are intended to reference a non-exclusive inclusion, such thata process, method, article, composition or apparatus that comprises alist of elements does not include only those elements recited, but mayalso include other elements not expressly listed or inherent to suchprocess, method, article, composition or apparatus. Other combinationsand/or modifications of the above-described structures, arrangements,applications, proportions, elements, materials or components used in thepractice of the present invention, in addition to those not specificallyrecited, may be varied or otherwise particularly adapted to specificenvironments, manufacturing specifications, design parameters or otheroperating requirements without departing from the general principles ofthe same.

Although the invention has been described herein with reference tocertain preferred embodiments, one skilled in the art will readilyappreciate that other applications may be substituted for those setforth herein without departing from the spirit and scope of the presentinvention. Accordingly, the invention should only be limited by theClaims included below.

1. An apparatus, comprising: a housing; an inductor mounted in said housing; and a cooling system configured to hold a refrigerant both: in said housing; and in direct contact with an element of said inductor, wherein during use said refrigerant comprises a liquid phase and a gas phase in said housing.
 2. The apparatus of claim 1, said inductor further comprising: a core material; and a winding about said core, wherein said core material comprises a distributed mixture of particles, a majority of said particles each comprising a magnetic material coated by a non-magnetic material.
 3. The apparatus of claim 2, said particles comprising nearest neighbors, wherein an average distance between the nearest neighbors comprises a distance of less than one millimeter.
 4. The apparatus of claim 1, said inductor comprising one of a plurality of inductors in a multi-phase power filtering system.
 5. The apparatus of claim 1, said inductor mounted to said housing using a glass reinforced plastic material.
 6. The apparatus of claim 1, said housing configured for mounting on a vertical surface.
 7. The apparatus of claim 1, said inductor further comprising: a first face; a second face; an aperture running from said first face to said second face; and an outer edge circumferentially surrounding the aperture, said outer edge mounted to said housing, said first face aligned vertically.
 8. The apparatus of claim 1, further comprising: a clamp bar configured to extend into an inner aperture through said inductor.
 9. The apparatus of claim 1, said inductor configured to carry a magnetic field of less than seven thousand Gauss at three hundred Oersteds during use.
 10. The apparatus of claim 1, said inductor configured to process greater than two thousand volts from line to line in a multi-phase system during use.
 11. The apparatus of claim 10, said inductor configured to carry greater than twenty thousand volts from line to line in a multi-phase system during use.
 12. The apparatus of claim 1, said inductor further comprising: a front face; a back face; an outer surface connecting said front face to said back face; a winding proximately contacting at least one of said front face, said back face, and said outer surface; and at least two inductor winding spacers proximately contacting and extending radially outward from at least one of said front face, said back face, and said outer surface, wherein said inductor winding spacers segment an outer surface of said inductor into sections, wherein said inductor winding spacers separate at least two individual turns of said winding.
 13. The apparatus of claim 1, further comprising: a winding wire forming turns about said inductor between a geometric center of said inductor and an outer face of said inductor, said winding wire comprising a cross-sectional shape with a width of said wire comprising a length at least two times a height of said wire.
 14. The apparatus of claim 1, further comprising: a winding wire forming at least one turn about said inductor, said winding wire comprising a non-circular cross-sectional shape.
 15. An apparatus, comprising: a housing; an inductor mounted in said housing; and a cooling system configured to hold a refrigerant both: in said housing; and within one-eighth of an inch of an element of said inductor, wherein during use said refrigerant comprises a liquid phase and a gas phase in said housing.
 16. The apparatus of claim 15, said cooling system configured to repetitively circulate the refrigerant through a condenser and a pump, said condenser and said pump connected to said housing using a refrigerant line.
 17. The apparatus of claim 15, the refrigerant comprising a non-conductive fluid, at room temperature and pressure, that resists flow of electricity.
 18. The apparatus of claim 15, said refrigerant comprising at least one of: a chlorocarbon; a fluorocarbon; a chlorofluorocarbon; a halocarbon; and a halogenated material.
 19. A method, comprising the steps of: providing an inductor in a housing; moving a refrigerant into proximate contact with said inductor; using heat from said inductor to phase change said refrigerant from a liquid to a gas; and transporting said gas out of said housing.
 20. The method of claim 19, wherein said inductor comprises: a core circumferentially surrounding an aperture; and at least one winding wire wrapped about a portion of said core, said refrigerant directly contacting at least a portion of said inductor during use. 